Electrostatic charge sensor with high impedance contact pads

ABSTRACT

The present disclosure is directed to a device that provides high impedance contact pads for an electrostatic charge sensor. The contact pads are shared between the electrostatic charge sensor and drivers. The contact pads are set to a high impedance state by reducing current leakage through the drivers. Compared to electrostatic charge sensor with low impedance contact pads, the electrostatic charge sensor disclosed herein has high sensitivity, and is able to detect weak electrostatic fields.

BACKGROUND Technical Field

The present disclosure is directed to circuitry for electrostatic chargesensors.

Description of the Related Art

Electrostatic charge sensors measure an electrostatic charge in asurrounding environment, and are used for a variety of applications,such as motion detection and location detection. Electrostatic chargesensors typically include one or more electrodes that detectelectrostatic in the air of a surrounding environment, and variouselectrical components (e.g., resistors, capacitors, amplifiers, etc.)that measure the electrostatic charge detected by the one or moreelectrodes. The electrodes of the electrostatic charge sensor are oftenelectrically connected to contact pads or pins of the containing device,such as a multi-sensor device, along with other electrical components.

Many electrostatic charge sensors suffer from current leakage.Electrical current will often drain from the contact pads, which areconnected to the electrodes of the electrostatic charge sensor, due tothe presence of other electrical components within the containingdevice. As more current leaks from the contact pads, the electrostaticcharge signal detected by the electrodes lowers and eventually becomesunusable. Consequently, the sensitivity of the electrostatic chargesensor is drastically reduced, as it becomes difficult to measure weakelectrostatic fields. Devices are especially susceptible to currentleakage in higher temperatures.

BRIEF SUMMARY

The present disclosure is directed to a device with high impedancecontact pads for an electrostatic charge sensor. The contact pads areshared between the electrostatic charge sensor and output drivers. Thecontact pads are set to a high impedance state by overchargingtransistors of the output drivers with pumped electrical signals. Theovercharging greatly reduces current leakage through the output drivers.As a result, compared to electrostatic charge sensor with low impedancecontact pads, the electrostatic charge sensor disclosed herein has highsensitivity, and is able to detect weak electrostatic fields.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

In the drawings, identical reference numbers identify similar featuresor elements. The size and relative positions of features in the drawingsare not necessarily drawn to scale.

FIG. 1 is a block diagram of a device according to an embodimentdisclosed herein.

FIG. 2 is a circuit diagram of a positive charge pump according to anembodiment disclosed herein.

FIG. 3 is a circuit diagram of a negative charge pump according to anembodiment disclosed herein.

DETAILED DESCRIPTION

In the following description, certain specific details are set forth inorder to provide a thorough understanding of various aspects of thedisclosed subject matter. However, the disclosed subject matter may bepracticed without these specific details. In some instances, well-knownstructures and methods of manufacturing electronic components andsensors have not been described in detail to avoid obscuring thedescriptions of other aspects of the present disclosure.

Unless the context requires otherwise, throughout the specification andclaims that follow, the word “comprise” and variations thereof, such as“comprises” and “comprising,” are to be construed in an open, inclusivesense, that is, as “including, but not limited to.”

Reference throughout the specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment. Thus, the appearance of the phrases “in oneembodiment” or “in an embodiment” in various places throughout thespecification are not necessarily all referring to the same aspect.Furthermore, the particular features, structures, or characteristics maybe combined in any suitable manner in one or more aspects of the presentdisclosure.

As discussed above, electrostatic charge sensors often suffer fromcurrent leakage as electrical current will often flow away from thecontact pads that are connected to the electrodes of the electrostaticcharge sensor. Current leakage is primarily caused by other electricalcomponents that share the same contact pads.

In order to minimize or possibly eliminate current leakage from theelectrostatic charge sensor, it is desirable to capture theelectrostatic charge with contact pads having high impedance. Onepossible way to provide high impedance contact pads is to utilizededicated contact pads for the electrostatic charge sensor. For example,a device may include contact pads that are electrically coupledexclusively to the electrodes of the electrostatic charge sensor, andelectrically isolated from remaining components of the device. However,dedicated contact pads are often undesirable since many devices have alimited number of pins and are unable to allocate dedicated pins for asingle sensor. Thus, it is common for each pin of a device to be sharedfor analog and digital purposes, such as for receiving electricalsignals for various internal electrical components (e.g., processors,sensors, resistors, capacitors, amplifiers, etc.) and for outputtingvarious electrical signals (e.g., driving signals, digital signals,communication signals, etc.). Output drivers in particular cause poorimpedance of contact pads as large amounts of current will leak throughthe drivers themselves (leakage may be on the order of nano amps), ascompared to the very small electrostatic charge being measured.

The present disclosure is directed to a device with high impedancecontact pads for an electrostatic charge sensor. The contact pads areshared between the electrostatic charge sensor and, for example, outputdrivers. The contact pads are set to a high impedance state byovercharging transistors of the output drivers with pumped electricalsignals. The overcharging greatly reduces current leakage through theoutput drivers. As a result, the electrostatic charge sensor disclosedherein has high sensitivity, and is able to detect weak electrostaticfields.

FIG. 1 is a block diagram of a device 10 according to an embodimentdisclosed herein. The device 10 may be any electronic device thatincludes an electrostatic charge sensor. For example, the device 10 maybe a smart watch, a fitness tracking device, wireless headphones, alaptop computer, a tablet, or a cellular phone. The device 10 may alsobe an electrical component, such as a multi-sensor device that includesother types of sensors (e.g., an accelerometer, a pressure sensor, agyroscope, a proximity sensor, etc.).

The device 10 includes electrodes 12, contact pads 14, reset circuits15, electrostatic charge sensors 16, output drivers 18, positive chargepumps 20, level up shifters 22, negative charge pumps 24, level downshifters 26, and controllers 28.

In the embodiment shown in FIG. 1 , the device 10 includes a contact pad14, a reset circuit 15, an electrostatic charge sensor 16, an outputdriver 18, a positive charge pump 20, a level up shifter 22, a negativecharge pump 24, a level down shifter 26, and a controller 28 for each ofthe electrodes 12. The device 10 may also include circuitry that isshared between multiple electrodes. For example, one or more of thepositive charge pump 20, the level up shifter 22, the negative chargepump 24, the level down shifter 26, and the controller 28 may be sharedbetween the electrodes 12.

Each of the electrodes 12 is electrically coupled to a respectivecontact pad 14. The electrodes 12 receive an electrostatic charge orfield 34 in a surrounding environment. The electrostatic charge 34 maybe generated from a wide variety of sources, such as motion by personand a presence of an alternating current (AC) power line. Although twoelectrodes are shown in FIG. 1 , the device 10 may include any number ofelectrodes. In one embodiment, the device 10 includes a singleelectrode.

The geometry of the electrodes 12 determines the sensitivity anddirectivity of the electrostatic charge sensor 16. For example, thesensitivity is proportional to the surface area of the electrodes 12,and the shape and position of the electrodes 12 affect the directivityof the electrostatic charge sensor 16. In one embodiment, each of theelectrodes 12 is square in shape.

In one embodiment, the electrodes 12 are positioned inside of the device10. For example, the electrodes 12 are mounted on a printed circuitboard (PCB) of the device 10, along with other components of the device10. In another embodiment, the electrodes 12 are positioned on one ormore exposed surfaces of the device 10 such that the electrodes 12 aredirectly exposed to a surrounding environment.

The contact pads 14 are electrically coupled to respective electrodes 12and nodes 36. The contact pads 14 are conductive contacts or pins thatreceive the electrostatic charge 34 received by the electrodes 12.

Each of the contact pads 14 may serve as input or an output for multiplecircuits. For example, each of the contact pads 14 may be electricallycoupled to, in addition to the electrostatic charge sensor 16 and theoutput driver 18 shown in FIG. 1 , analog and digital circuits thatoutput and receive signals (e.g., analog signals, digital signals,communication signals, etc.) via the contact pad 14.

Each of the reset circuits 15 is electrically coupled to a respectivecontact pad 14 via a respective node 36. The reset circuit 15 is used toset the node 36 to a voltage reference VREF prior to the electrostaticcharge sensor 16 measuring electrostatic charge. Without the presence ofthe reset circuit 15, the node 36 may have any voltage level and causean electrostatic charge signal received by the electrode 12 to drift,resulting in inaccurate measurements by the electrostatic charge sensor16.

The reset circuit 15 has a charging phase and a reset phase. In thecharging phase, a variable capacitor 38 of the reset circuit 15 ischarged to the voltage reference VREF by closing switch 42 and openingswitch 40. The reset circuit 15 is disconnected from the node 36 in thecharging phase. The reset circuit may be in the charging phase when (1)the output driver 18, which is also electrically coupled to the node 36,is in an on state (e.g., outputting a driving signal) or (2) theelectrostatic charge sensor 16 is currently measuring electrostaticcharge. The on state of the output driver 18 will be discussed infurther detail below.

In the reset phase, the variable capacitor 38, which is charged to thevoltage reference VREF, is connected to the node 36 by opening switch 42and closing switch 40. As a result, the node 36 is set or reset to thevoltage reference VREF in the reset phase. The reset circuit 15 is inthe reset phase when (1) the output driver 18 is in an off state (e.g.,not outputting a driving signal) and (2) the electrostatic charge sensor16 is currently not measuring electrostatic charge. As a result, thereset circuit 15 does not affect driving signals outputted from theoutput driver 18 and signals measured by the electrostatic charge sensor16. The reset phase may be repeated at a determined frequency torepeatedly re-center to the node 36 at the voltage reference VREF. Theoff state of the output driver 18 will be discussed in further detailbelow.

The capacitance of the variable capacitor 38 may be set based on theapplication of the device 10. In general, a large capacitance allows thenode 36 to be set to VREF more strongly (or with lower impedance), whichin turn minimizes the effect of current leakage from the output drivers18 on electrostatic charge measurements by the electrostatic chargesensor 16. However, the large capacitance reduces sensitivity of theelectrostatic charge sensor 16.

The electrostatic charge sensor 16 is electrically coupled to thecontact pads 14 via the nodes 36. The electrostatic charge sensor 16measures electrostatic charge received by the electrodes 12. Theelectrostatic static charge sensor 16 measures electrostatic charge as adifferential between electrostatic charges received by the twoelectrodes 12. As discussed above, each of the nodes 36 is set at, or atleast near, the voltage reference VREF prior to measurement by theelectrostatic charge sensor 16. Thus, during measurement by theelectrostatic charge sensor 16, electrostatic charges received by theelectrodes 12 are offset by an amount approximately equal to the voltagereference VREF. The electrostatic charge sensor 16 includes a notchfilter 30 and a gain stage 32.

The notch filter 30 filters the measured electrostatic charge to removenoise or unwanted frequencies. For example, the notch filter 30 removesfrequencies between 45 and 65 hertz to remove noise caused by AC powerlines. Other types of filters are also possible. For example, the notchfilter 30 may be replaced with a low pass filter, a high pass filter, ora band pass filter.

The measured electrostatic charge is then transmitted to the gain stage32. The gain stage 32 amplifies or increases the power/amplitude of themeasured electrostatic charge. The gain stage 32 then outputs themeasured electrostatic charge for further processing. For example, themeasured electrostatic charge may be transmitted to an analog-to-digitalconverter (ADC) to generate a digital signal indicating a variation ofthe electrostatic charge 34.

The electrostatic charge sensor 16 does not measure electrostatic chargewhile the output drivers 18 are in an on state (i.e., outputting drivingsignals). The electrostatic charge sensor 16 measure electrostaticcharge while the output drivers 18 are in an off state (i.e., notoutputting driving signals).

Each of the output drivers 18 is electrically coupled to respectivecontact pads 14 via the nodes 36. The output drivers 18 output drivingsignals as instructed by the controller 28. Each of the output drivers18 include a p-channel metal-oxide semiconductor (PMOS) transistor 44and an n-channel metal-oxide semiconductor (NMOS) transistor 46. Asource of the PMOS transistor 44 receives a voltage VDDIO, a gate of thePMOS transistor 44 is electrically coupled to the level up shifter 22and receives a PMOS gate signal PVDDIO, and a drain of the PMOStransistor 44 is electrically coupled to the node 36 and the source ofthe NMOS transistor 46. A drain of the NMOS transistor 46 iselectrically coupled to the node 36 and the drain of the PMOS transistor44, a gate of the NMOS transistor 46 is electrically coupled to thelevel down shifter 26 and receives a NMOS gate signal PGND, and a sourceof the NMOS transistor 46 is electrically coupled to ground. The voltageVDDIO, the PMOS gate signal PVDDIO, and the NMOS gate signal PGND areelectrical signals.

In one embodiment, the PMOS transistor 44 and the NMOS transistor 46 arelarge transistors in order for high voltage driving signals to beoutputted by the output drivers 18. For example, the PMOS transistor 44may have a width between 550 and 650 micrometers, and the NMOStransistor 46 may have a width between 200 and 300 micrometers.

In an on state, the output driver 18 outputs driving signals (e.g., thevoltage VDDIO or a grounded signal) as instructed by the controller 28.In the on state, either of the PMOS transistor 44 or NMOS transistor 46is in a conducting state. The PMOS transistor 44 is set to a conductingstate by applying a low voltage signal (e.g., 0 to 0.5 volts) to thegate of the PMOS transistor 44, and the NMOS transistor 46 is set to aconducting state by applying a high voltage signal (e.g., 4 to 5 volts)to the gate of the NMOS transistor 44.

In an off state, the output drivers 18 do not output driving signals andare in a high impedance state so as to not affect measurements by theelectrostatic sensor 16. In the off state, the PMOS transistor 44 andthe NMOS transistor 46 are in a non-conducting state. The PMOStransistor 44 is set to a non-conducting state by applying the PMOS gatesignal PVDDIO to the gate of the PMOS transistor 44, and the NMOStransistor 46 is set to a non-conducting state by applying the NMOS gatesignal PGND to the gate of the NMOS transistor 44. As will be discussedin further detail below, the PMOS gate signal PVDDIO and the NMOS gatesignal PGND are pumped electrical signals.

The output drivers 18 may also be used to protect the device 10, morespecifically other electrical components within the device 10, frombeing damaged by, for example, electrostatic discharge (ESD) though thecontact pads 14. An ESD event may be caused by a person touching theelectrodes 12 or the contact pads 14. The output drivers 18 may be usedas protection circuits by, for example, setting the PMOS transistors 44to a conducting state and allowing current to flow through the PMOStransistors 44.

The output drivers 18 are potential sources of current leakage and maycause the contact pads 14 to have low impedance. Even while the outputdrivers 18 are in the off state, current may leak from the contact pad14 and through the output drivers 18 (e.g., through the PMOS transistor44 and the NMOS transistor 46). For example, 100 picoamps to 10 nanoampsof current may leak through the PMOS transistor 44 and the NMOStransistor 46. Further, the amount of current leakage is proportional tothe size of the output drivers 18 and temperature. Output drivers 18with large transistors, such as the PMOS transistor 44 and the NMOStransistor 46, will have large amounts of current leakage compared tosmaller transistors. Even further, in higher temperatures, the amount ofcurrent leakage increases even more. As more current leaks from thecontact pad 14, the electrostatic charge received by the electrodes 12lowers and eventually becomes unusable. Consequently, the sensitivity ofthe electrostatic charge sensor 16 is drastically reduced, as it becomesdifficult to measure weak electrostatic fields.

In order to reduce or even eliminate current leakage through the outputdrivers 18 while in the off state, the output drivers 18 are providedwith pumped signals at their respective gates. As discussed above, inthe off state, the PMOS gate signal PVDDIO is applied to the gate of thePMOS transistor 44, and the NMOS gate signal PGND is applied to the gateof the NMOS transistor 44. In order to reduce or prevent current leakagethrough the output drivers 18, the PMOS gate signal PVDDIO is pumped toincrease its voltage level above the voltage VDDIO, and the NMOS gatesignal PGND is pumped to decrease its voltage level below ground (e.g.,a negative value). In one embodiment, the PMOS gate signal PVDDIO isbetween 0.2 and 0.4 volts greater than the voltage VDDIO. In oneembodiment, the NMOS gate signal PGND is between 0.2 and 0.4 volts lessthan ground. By overcharging the gates of the PMOS transistor 44 and theNMOS transistor 46 act as super cut-off mosfets and current leakage isreduced. Current leakage may be reduced to be less than 100 picoamps. Asa result, the contact pads 14 are in a high impedance state while theoutput drivers 18 are in the off state.

The positive charge pump 20 pumps the PMOS gate signal PVDDIO toincrease its voltage level above the voltage VDDIO (e.g., between 0.2and 0.4 volts greater than the voltage VDDIO). FIG. 2 is a circuitdiagram of the positive charge pump 20 according to an embodimentdisclosed herein.

The positive charge pump 20 includes a first capacitor 48, a secondcapacitor 50, a first switch 51, a second switch 53, a third switch 52,and a fourth switch 54. As shown in FIG. 2 , the first switch 51, thesecond switch 53, the third switch 52, and the fourth switch 54 may beimplemented as transistors.

The first capacitor 48 is electrically coupled between the first switch51 and the second switch 53, and between the third switch 52 and thefourth switch 54. The second capacitor 50 is electrically coupledbetween the second switch 54 and ground. The first switch 51 iselectrically coupled between the first capacitor and ground. The secondswitch 53 is electrically coupled to the first capacitor 48 and receivesa voltage reference VREF2. In one embodiment, the voltage referenceVREF2 is between 0.2 and 0.4 volts. The third switch 52 is electricallycoupled to the first capacitor 48 and receives the voltage VDDIO. Theopening and closing of the first switch 51 and the second switch 53 arecontrolled by a first control signal CS1, and the opening and closing ofthe third switch 52 and the second switch 54 are controlled by a secondcontrol signal CS2. In one embodiment, the first control signal CS1 andthe second control signal CS2 are generated and provided by thecontroller 28.

During a first phase of operation, the first switch 51 and the secondswitch 53 are closed, and the third switch 52 and the fourth switch 54are opened. Thus, in the first phase, the first capacitor 48 is chargedby the voltage reference VREF2. Subsequently, in a second phase ofoperation, the first switch 51 and the second switch 53 are opened, andthe third switch 52 and the fourth switch 54 are closed. As a result,the PMOS gate signal PVDDIO is generated at output 56. The PMOS gatesignal PVDDIO is approximately the sum of the voltage reference VREF2and the voltage VDDIO.

Returning to FIG. 1 , the level up shifter 22 is electrically coupled tothe gate of the PMOS transistor 44, the positive charge pump 20, and thecontroller 28. The level up shifter 22 shifts or converts controlsignals received from the controller 28 up to a desired voltage levelfor the PMOS transistor 44, more specifically the gate of the PMOStransistor 44.

In one embodiment, the level up shifter 22 provides the PMOS gate signalPVDDIO, which is generated by the positive charge pump 20, to the gateof the PMOS transistor 44 according to a control signal received fromthe controller 28. For example, the level up shifter 22 transmits thePMOS gate signal PVDDIO to the gate of the PMOS transistor 44 uponreceiving an instruction from the controller 28 to set the output driver18 to an off state. In another embodiment, the positive charge pump 20transmits the PMOS gate signal PVDDIO directly to the gate of the PMOStransistor 44 according to control signals received from the controller28.

The negative charge pump 24 pumps the NMOS gate signal PGND to decreaseits voltage level below ground (e.g., between 0.2 and 0.4 volts lessthan ground). FIG. 3 is a circuit diagram of the negative charge pump 24according to an embodiment disclosed herein.

The negative charge pump 24 includes a first capacitor 58, a secondcapacitor 60, a first switch 61, a second switch 63, a third switch 62,and a fourth switch 64. As shown in FIG. 3 , the first switch 61, thesecond switch 63, the third switch 62, and the fourth switch 64 may beimplemented as transistors.

The first capacitor 58 is electrically coupled between the first switch61 and the second switch 63, and between the third switch 62 and thefourth switch 64. The second capacitor 60 is electrically coupledbetween the second switch 64 and ground. The first switch 61 iselectrically coupled between the first capacitor and ground. The secondswitch 63 is electrically coupled to the first capacitor 58 and receivesa voltage reference VREF2. In one embodiment, the voltage referenceVREF2 is between 0.2 and 0.4 volts. The third switch 62 is electricallycoupled between the first capacitor 58 and ground. The opening andclosing of the first switch 61 and the second switch 63 are controlledby a first control signal CS1, and the opening and closing of the thirdswitch 63 and the second switch 63 are controlled by a second controlsignal CS2. In one embodiment, the first control signal CS1 and thesecond control signal CS2 are generated and provided by the controller28.

During a first phase of operation, the first switch 61 and the secondswitch 63 are closed, and the third switch 62 and the fourth switch 64are opened. Thus, in the first phase, the first capacitor 58 is chargedby the voltage reference VREF2. Subsequently, in a second phase ofoperation, the first switch 61 and the second switch 63 are opened, andthe third switch 62 and the fourth switch 64 are closed. As a result,the NMOS gate signal PGND is then generated at output 66. The NMOS gatesignal PGND is below ground by approximately the voltage referenceVREF2.

Returning to FIG. 1 , the level down shifter 26 is electrically coupledto the gate of the NMOS transistor 46, the negative charge pump 24, andthe controller 28. The level down shifter 26 shifts or converts controlsignals received from the controller 28 up to a desired voltage levelfor the NMOS transistor 46, more specifically the gate of the NMOStransistor 46.

In one embodiment, the level down shifter 26 provides the NMOS gatesignal PGND, which is generated by the negative charge pump 24, to thegate of the NMOS transistor 46 according to a control signal receivedfrom the controller 28. For example, the level down shifter 26 transmitsthe NMOS gate signal PGND to the gate of the NMOS transistor 46 uponreceiving an instruction from the controller 28 to set the output driver18 to an off state. In another embodiment, the negative charge pump 24transmits the NMOS gate signal PGND directly to the gate of the NMOStransistor 46 according to control signals received from the controller28.

It is noted that the output drivers 18 are examples of circuits that mayshare the contact pads 14 with the electrostatic charge sensor 16. Thepositive charge pumps 20, the level up shifters 22, the level downshifters 26, and the negative charge pumps 24 discussed above may beused in conjunction with other types of circuits with transistors aswell.

The various embodiments disclosed herein provide a device with highimpedance contact pads. The contact pads are shared between anelectrostatic charge sensor and output drivers. In order to reducecurrent leakage through the output drivers, the contact pads are set toa high impedance state by overcharging transistors of the outputdrivers. As a result, the electrostatic charge sensor disclosed hereinhas high sensitivity, and is able to detect weak electrostatic fields.

The various embodiments described above can be combined to providefurther embodiments. These and other changes can be made to theembodiments in light of the above-detailed description. In general, inthe following claims, the terms used should not be construed to limitthe claims to the specific embodiments disclosed in the specificationand the claims, but should be construed to include all possibleembodiments along with the full scope of equivalents to which suchclaims are entitled. Accordingly, the claims are not limited by thedisclosure.

1. A device, comprising: an electrode configured to receive anelectrostatic charge; a contact pad electrically coupled to theelectrode; an electrostatic charge sensor electrically coupled to thecontact pad, the electrostatic charge sensor configured to measure theelectrostatic charge; a driver electrically coupled to the contact pad,the driver configured to output a driving signal to the contact pad, thedriver electrically coupled between a first electrical signal andground; a first charge pump configured to generate a second electricalsignal having a greater voltage level than the first electrical signal;and a second charge pump configured to generate a third electricalsignal having a voltage level below ground, the driver configured to beset to an off state using the second electrical signal and the thirdelectrical signal.
 2. The device of claim 1, further comprising: a resetcircuit electrically coupled to the contact pad via a node, the resetcircuit configured to set the node to a determined voltage.
 3. Thedevice of claim 2 wherein the reset circuit includes a variablecapacitor.
 4. The device of claim 1 wherein the driver includes a firsttransistor and a second transistor, the first transistor is electricallycoupled between the first electrical signal and the second transistor,and the second transistor is electrically coupled between the firsttransistor and ground.
 5. The device of claim 4 wherein driver is set tothe off state by applying the second electrical signal to a gate of thefirst transistor, and the third electrical signal to a gate of thesecond transistor.
 6. The device of claim 4 wherein the first transistoris a p-channel metal-oxide semiconductor (PMOS) transistor, and thesecond transistor is an n-channel metal-oxide semiconductor (NMOS)transistor.
 7. The device of claim 1 wherein the electrostatic chargesensor includes: a notch filter configured to filter the measuredelectrostatic charge signal; and a gain stage configured to amplify themeasured electrostatic charge signal subsequent to the measuredelectrostatic charge signal being filtered by the notch filter.
 8. Thedevice of claim 1, further comprising: a controller; a level up shifterconfigured to provide the second electrical signal to the driveraccording to a control signal from the controller; and a level downshifter configured to provide the third electrical signal to the driveraccording to another control signal from the controller.
 9. The deviceof claim 1 wherein the first charge pump includes: a first switchelectrically coupled to ground; a second switch configured to receive areference voltage; a third switch configured to receive the firstelectrical signal; a first capacitor electrically coupled to the firstswitch and the third switch; a fourth switch electrically coupled to thefirst capacitor and the second switch; and a second capacitorelectrically coupled to the fourth switch and ground.
 10. The device ofclaim 1 wherein the second charge pump includes: a first switchelectrically coupled to ground; a second switch configured to receive areference voltage; a third switch electrically coupled to ground; afirst capacitor electrically coupled to the first switch, the secondswitch, and the third switch; a fourth switch electrically coupled tothe first capacitor; and a second capacitor electrically coupled to thethird switch and ground.
 11. A device, comprising: a plurality ofelectrodes configured to receive an electrostatic charge; a plurality ofcontact pads, each of the plurality of contact pads being electricallycoupled to a respective electrode of the plurality of electrodes; anelectrostatic charge sensor configured to measure the electrostaticcharge; a plurality of drivers configured to output driving signals,each of the plurality of drivers being configured to receive a firstelectrical signal and electrically coupled to ground, each of theplurality of contact pads being shared between the electrostatic chargesensor and a respective driver of the plurality of drivers; a pluralityof positive charge pumps configured to generate a plurality of secondelectrical signals that each have a greater voltage level than the firstelectrical signal; and a plurality of negative charge pumps configuredto generate a plurality of third electrical signals that each have avoltage level below ground, each of the plurality of drivers configuredto receive a respective second electrical signal of the plurality ofsecond electrical signals and a respective third electrical signal ofthe plurality of third electrical signals.
 12. The device of claim 11,further comprising: a plurality of reset circuits, each of the pluralityof reset circuits being electrically coupled a respective contact pad ofthe plurality of contact pads via respective a node, each of theplurality of reset circuits configured to set the respective node to adetermined voltage.
 13. The device of claim 11 wherein each of theplurality of the drivers includes a first transistor and a secondtransistor, the first transistor is configured to receive the firstelectrical signal and is electrically coupled to the second transistor,and the second transistor is electrically coupled to the firsttransistor and ground.
 14. The device of claim 13 wherein the firsttransistor is a p-channel metal-oxide semiconductor (PMOS) transistor,and the second transistor is an n-channel metal-oxide semiconductor(NMOS) transistor.
 15. The device of claim 14 wherein each of theplurality of drivers is set to an off state by applying the respectivesecond electrical signal to a gate of the first transistor, and therespective third electrical signal to a gate of the second transistor.16. The device of claim 11 wherein the electrostatic charge sensorincludes: a notch filter configured to filter the measured electrostaticcharge; and a gain stage configured to amplify the measuredelectrostatic charge.
 17. A device, comprising: an electrode configuredto receive an electrostatic charge; a contact pad electrically coupledto the electrode; an electrostatic charge sensor electrically coupled tothe contact pad, the electrostatic charge sensor configured to measurethe electrostatic charge; and a driver electrically coupled to thecontact pad and ground, the driver configured to receive a firstelectrical signal, a second electrical signal having a greater voltagelevel than the first electrical signal, and a third electrical signalhaving a voltage level below ground, the driver configured to output adriving signal to the contact pad using the first electrical signal, thedriver configured to be set to an off state using the second electricalsignal and the third electrical signal.
 18. The device of claim 17wherein the driver includes a first transistor and a second transistor,the first transistor is configured to receive the first electricalsignal and is electrically coupled to the second transistor, and thesecond transistor is electrically coupled to the first transistor andground.
 19. The device of claim 18 wherein the first transistor is ap-channel metal-oxide semiconductor (PMOS) transistor, and the secondtransistor is an n-channel metal-oxide semiconductor (NMOS) transistor.20. The device of claim 19 wherein the driver is set to the off state byapplying the second electrical signal to a gate of the first transistor,and the third electrical signal to a gate of the second transistor.